Intel® Xeon® D: A Significant Leap Forward in General Purpose Processor (GPP) Technology Across the Spectrum of Defense Applications

January 30, 2018

The amount of processing that can be performed within the size, weight, power, and cost (SWaP-C) envelope of a defense system’s electronics payload has long been a limiting factor of mission capability. To maximize this performance, defense engineers have long used a mix of FPGAs, GPUs, and General-Purpose Processors (GPPs), but recent advances in the Intel® Xeon® system on chips (SoCs) D are rendering these heterogeneous architectures unnecessary while delivering unmatched signal processing power and efficiency.

In this white paper, aerospace and defense engineers will learn:

  • How Intel® Xeon® processors D enable performance and flexibility in military electronics payloads
  • Best practices for selecting an efficient signal processing module
  • Examples of how these solutions can be deployed in a mobile tactical server
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