Innovations for telematics, logistics, and mass transit
ADLINK Technology compares the next generation computer-on-module standard, COM-HPC, to traditional standards and demonstrates the benefits it is seeing in its own solutions at embedded world 2022.
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Should you switch to the next computer-on-module for high performance computing, COM-HPC, or stick with the previous COM Express standard? Hear what Advantech recommends at embedded world 2022.
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COM-HPC is quickly becoming the preferred computer-on-module standard, but that doesn’t mean COM Express is going away. congatec displays the benefits of both standards at embedded world 2022.
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At embedded world 2022, SECO is showcasing how its technological solutions and AIoT analytics software solution Clea gives customers real-time access to insight data right from on-field devices.
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Kontron is displaying the power customers can get from the new computer-on-module standard for high performance computing (COM-HPC) combined with Intel® servers at years embedded world 2022
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The last couple of years have brought a lot of supply chain and production challenges. Hear how a modular approach help customers tackle those challenges with little time and investment.
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Learn everything you need to know about the next-generation computer-on-module standard COM-HPC and its new state-of-the-art capabilities from this year’s embedded world exhibition and conference.
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Business owners are busy focusing on their customers, employees, and partners. Video security isn’t always top of mind. Read how today’s IoT security solutions safeguard operations, and much more.
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Deploying safety measures to protect against internal and external risks is a constant challenge—especially in dynamic environments like airports. Read how IoT tech makes it easier to accomplish.
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Missed Intel® Vision 2022? There’s still time to get started on your digital transformation and edge AI innovation journey with these free on-demand sessions.
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Approaching AI can be very intimidating. But with the right tools, like OpenShift and OpenVINO™, all the heavy lifting is done for you—allowing you to focus on what really matters: your business.
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AI development is a hot topic these days, but many industries don’t have the skills necessary to embark on an AI journey. Find out what tools you need to overcome these barriers and boost efforts.
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The future of universal mobile robots requires building blocks that blend performance, efficiency, and advanced software support. 12th Gen Intel® Core™ Processors deliver on this future, today.
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How can you successfully deploy AI apps and start improving your business? Listen to this podcast to learn about the full AI app lifecycle and how tools like OpenVINO™ can simplify the process.
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How do you score a top-notch user experience? With a hybrid cloud and hyperconverged infrastructure that provides real-time feedback, identifies bottlenecks, and improves operations on the fly.
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What tools and resources do AI developers need to get started or boost their AI efforts? Check out this list of the top AI frameworks and building blocks necessary to be successful in this field.
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It can be confusing trying to navigate around the IoT partner multiverse. That’s why Tech Data’s Better Together alliance is working to bridge the gap and ease the barrier to entry.
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Sustainability has become the number-one topic in both public and private entities worldwide. Read how IoT solutions, built by an ecosystem of partners, can make green initiatives a reality.
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The future of public transport is all about delivering enhanced passenger experiences through digitalized mobility. And by offering these services, transit operators gain new revenue opportunities.
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Learn how the latest release of the Intel® Distribution of OpenVINO™ Toolkit 2022.1 is helping AI developers overcome AI challenges, simplify their efforts, and create more innovative use cases.
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