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ADLINK Technologies at embedded world 2022

The next generation computer-on-module standard, COM-HPC, is giving companies more flexibility, speed, and power for their edge computing workloads. For example, ADLINK Technology, a global leader in edge computing, is working with COM-HPC because it is a form factor that eliminates interface limitations and uses high-performance connectors. This enables the company to provide a ruggedized solution that addresses its customers' high-computing needs.


Marco Krause: My name is Marco Krause. I’m the Global Account Director in ADLINK Technologies. I’m in charge for the bigger accounts and for the high technology and supportive accounts we have in our organization. So we, as ADLINK, we are enabling the edge of IoT, means we are bringing more computing performance, more industrial knowledge to the edge.

We decided to go for COM-HPC because it’s a form factor, which gives us a high flexibility in terms of pin out looking at all traditional form factors we had in type six, type seven, you had the limitation in terms of interfaces you can get out of the connectors. So now you have with both COM-HPC form factors, with the server type and the client type, you have two connectors with 330 pins, put them down.

So you have a high flexibility in creating the carrier board and the industrial server, you may require for your applications.

With having a strong partner like Intel in the field of play, who’s taking the major role for server devices in the field, packed with our experience in doing industrial designs, our producing board from scratch, made for mission critical applications.

I guess the benefit for our clients is really you don’t get the standard server out on the shop floor. You really have the solution, which is ruggedized to connecting customer needs, and you really have a server which you need ffor your daily task, which is more close to the edge, which is the customer application.

Of course, you know, concentrating on the hardware is not set of that. So we are connecting with all these cloud vendors out there like AWS, like MS. So our software stack allows us to connect to those guys seamlessly or even to the customer server infrastructure in order to get the data out to the cloud, like push in, push out immediately and without low latency.

That’s why we invested a lot of stuff and a lot of time there in our personal and our software developers, which are developing their own software up in UK.

So we get very good response from high computing demand customers like in data locking, where you really need to collect data and need to push out the data from a different end point. That seems to be a very interesting market. Reason for that is, as I mentioned earlier, the high flexibility coming from the HPC inform factor, the longevity you can have by having your own carrier bot on the bottom. And that’s one of the key form factors, right? Those data locking clients and military customers are really eager for this platform.

So that’s a good response we got from those.

The preceding transcript is provided to ensure accessibility and is intended to accurately capture an informal conversation. The transcript may contain improper uses of trademarked terms and as such should not be used for any other purposes. For more information, please see the Intel® trademark information.

About the Author

Brandon brings more than a decade of high-tech journalism and media experience to his current role as Editor-in-Chief of the electronics engineering publication Embedded Computing Design. His coverage focuses on artificial intelligence and machine learning, the Internet of Things, cybersecurity, embedded processors, edge computing, prototyping kits, and safety-critical systems, but extends to any topic of interest to the electronic design community. Brandon leads interactive YouTube communities around platforms like the Embedded Toolbox video interview series and Dev Kit Weekly hardware reviews, and co-hosts the Embedded Insiders Podcast. Drop him a line at or DM him on Twitter @techielew.

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