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Using Skylake-SP LGA Devices in Rugged Environments

October 4, 2017

Intel® Xeon® Scalable Processors provide major advances for military systems, but the processors’ large Land Grid Array (LGA) packaging makes it a challenge to deploy in rugged SWaP-constrained environments. A new process allows LGA devices to be soldered directly to the PCB, allowing the new processors to withstand the shock, vibration, and temperature cycling common in defense applications.

In this white paper, you will learn:

  • About the major enhancements of Intel® Xeon® Scalable Processors that benefit defense systems
  • About a process developed by Mercury Systems for converting LGA to BGA
  • How this process has been applied to Intel® Xeon® Scalable Processors for defense applications
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