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The Power of Edge-to-Cloud AI is Big News at embedded world

The first day of embedded world has wrapped up and thankfully there are two more days to explore, listen, and learn. Today’s big topics? The power of edge-to-cloud AI, security built from the ground up and super valuable developer tools. And because so much of the IIoT is way out on the edge, ruggedized was another word for the day. Here are a few highlights—be sure to check them out.

From technology and tools, to new products and ecosystems—AI is front and center. With systems for smart factories, smart cities, smart homes, and more, we’re seeing the real deal with tools that are reducing the challenges of developing AI-centric solutions.

Case in point is Avnet Integrated, showcasing its new AI-at-the-Edge Meta-Sensing product—SmartEdge Agile—designed to ease the complexities of deep-learning development. Building AI models and pushing them to the edge is supported by Brainium’s zero-coding platform hosted on Microsoft Azure.

From PoC to pilot to production, it offers one solution for all stages of IoT project development—with hardware, a full software stack, reference designs, BOMs, plus constant software and firmware updates. You can find Avnet at Hall 2 / 238.

Arrow Electronics shows its unique approach to harnessing the power of AI via the company’s technology, guidance and support. By teaming up with a big range of IoT suppliers, Arrow has an extensive portfolio of embedded vision solutions. This gives developers a leg up on in building secure edge-to-cloud platforms across a range of sectors including industrial, healthcare and transportation. Check them out at booth 4A / 340.

Security is always a hot topic with growing customer expectations that security is no longer an add on, but rather designed into IoT solutions from the ground up.

One company is tackling this challenge by employing Intel® Boot Guard. By implementing Boot Guard hardware-based technology Concurrent Technologies ensures that its processor boards are fundamentally more secure—preventing malware and other unauthorized software from replacing or tampering with the low-level UEFI firmware. Any attempt to use non-authorized firmware will result in the board failing to boot—especially critical in defense applications that depend on the firmware acting as the root of trust. Concurrent is in booth 1-519.

Also making use of Intel® Secure Boot is u-blox—with u‑connectScript—a new addition to its u‑connectXpress connectivity software (previously known as u-blox). The software series helps speed time-to-market by simplifying Bluetooth and Wi‑Fi device development while enabling a high level of security.

It’s based on JavaScript, using simple syntax, which means that device developers can quickly embed Bluetooth applications right onto their modules without requiring extensive embedded systems programming experience. Learn more by watching the videos on u‑connectXpress and u‑connectScript and visit them at booth 3-139.

With a different approach altogether, Canonical is introducing Ubuntu Core 18—bringing its popular Ubuntu 18.04 LTS to high-security embedded devices.With Ubuntu and Snapcraft ecosystems the solution is enabling anew class of app-centric things. Take note, because Ubuntu is the most widely deployed Linux in the world. There are 4,600 snaps published by 1700 independent publishers today.

Immutable, digitally signed snaps ensure that devices built with Ubuntu Core are resistant to corruption or tampering. Any component can be verified at any time. The attack surface of Ubuntu Core has been minimized, reducing the size and frequency of security updates and providing more storage for applications and data. Plus, app publishers can support multiple devices without recompiling. Be sure to take a look at what’s going on with Ubuntu at Hall 4-660.

Of course, embedded world wouldn’t be embedded world without developer tools and of course they can be found in every shape, size, and flavor all across the expo.

Take TenAsys for example. Alongside the Industrial Internet Consortium (IIC), and partnering with ISW of Stuttgart, the company is assisting in the build-out of functional test bed services. As OPC UA nears readiness for prioritized communications, the TenAsys Intime based ‘shaper’ services will be used to help bring new solutions to market.

The company is working to advance the Time Synchronous Networking initiative beyond proof of concept stage. The evolving real-time Ethernet standards for TSN and OPC UA intersect the company’s INtime real-time platform, with new functionality and tools—enabling Industry 4.0 opportunities.

On a different note, TenAsys has furthered its workload consolidation initiative with deterministic emphasis via additional C++17 and BOOST library support for Microsoft’s Visual Studio 2017.

With Intel® System Studio 2019, VTune Amplifier now supports the INtime RTOS targets—individually or alongside Windows. The dynamic profiler tool is a substantial step forward in understanding the utilization of PC hardware while applications are being executed. Definitely take a look at this and more at Booth 4-380.

No doubt that rapidly evolving technologies are increasing the pressure on already aggressive test schedules and requirements. National Instruments is addressing this challenge with new design validation and testing systems. NI is demonstrating how its open platform can validate and test ADAS, EV, and V2X systems—especially important for engineers that need a highly flexible test system.

The NI HIL system can be used to validate automotive controller software earlier in the design process which allows developers to find and fix faults faster. Open and flexible, it can be customized to developers’ exact requirements and interface without having to purchase unnecessary components. You can find NI in Hall 4, Booth 108.

The IoT is no stranger to challenging deployment environments. Eurotech is showing off its HPEC (High Performance Embedded Computing) systems that bring supercomputing and computational power to the edge for faster data access and management.

It helps developers overcome environmental and other IIoT deployments. HPEC provides rugged and embedded building blocks that are certified for the harshest industrial environments, designed for long-lifecycle applications, and extended reliability.

The company uses their innovative liquid cooling technology, to stand up to the harshest temperature, vibration and shock conditions in embedded environments. Look for Eurotech in Hall 3 - Booth 529.

Also up to the challenge is Crystal Group, demonstrating the RE1529—its latest rugged embedded computer. A sixteen-core Intel® Xeon® processor combined with data storage capacity brings server-class performance in a compact embedded footprint.

To operate in harsh conditions such as extreme temperatures, high shock and vibration, high humidity, high altitudes, and dust, it’s virtually maintenance free. And encryption-based cybersecurity protection is built using TPM technologies with Intel® processors and chipsets to guard sensitive data-at-rest to meet or exceed all military requirements. You can find Crystal Group at booth: 3-102.

For something completely different, Bosch Sensortec is showcasing its latest MEMS sensor solutions. They range from BMI270, a smart ultra-low power IMU designed for wearable applications to the BME680 gas sensor for smart home air quality measurement.

The MEMS sensor portfolio includes accelerometers, gyroscopes, magnetometers and environmental, IMU, and smart sensors – as well as a comprehensive portfolio of software and tools.

Bosch Sensortec Community is a valuable resource for developers to exchange information on a wide range of applications such as low power IoT devices, robotics, AR/VR, wearables and smartphones. Look for Bosch in Hall 4A / 544.

About the Author

Kenton Williston is the Editor-in-Chief of and served as the editor of its predecessor publication, the Embedded Innovator magazine. Kenton received his B.S. in Electrical Engineering in 2000 and has been writing about embedded computing and IoT ever since.

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